TrustMe © W77Q64/128/256/512/1024/2048Mb & TrustMe © W77T64/128/256/512/1024/2048Mb Sub-Chip
Winbond Electronics Corporation - FIPS 140 #5292
TrustMe © W77Q64/128/256/512/1024/2048Mb & TrustMe © W77T64/128/256/512/1024/2048Mb Sub-Chip is a purely hardware sub-chip cryptographic module running on the single-chip TrustMe © secure flash memory. The cryptographic service provided by the module is the message digest calculation based on the SHA2-256 cryptographic algorithm.
Key facts
- Scheme
- FIPS 140
- Certificate
- 5292
- Standard
- FIPS 140-3
- Security level
- Level 1
- Status
- active
- Vendor
- Winbond Electronics Corporation
- Module type
- Hardware
- Embodiment
- SingleChip
- Lab
- DEKRA Cybersecurity Certification Laboratory
- First validated
- May 25, 2026
- Sunset date
- May 24, 2031
- Caveat
- None
Algorithms
- SHA2-256
Algorithm families of the CAVP certificates listed for this module, plus post-quantum algorithms named in its documents.
CVEs that may affect this product
sec-certs has not matched any CVE to this certificate. That is not proof the product is unaffected.
Related CVEs and certificate references are automated matches by sec-certs, not reviewed by humans: treat them as "may be affected" and verify before acting.
Documents and sources
Source: sec-certs.org (CRoCS, Masaryk University), from NIST CMVP and the Common Criteria Portal - dataset of September 21, 2026 - synced October 15, 2026
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