Trusted Platform Module 2.0 SLB 9670
Infineon Technologies AG - FIPS 140 #3203
The TPM is a single chip module that provides computer manufacturers with the core components of a subsystem used to assure authenticity, integrity and confidentiality in e-commerce and internet communications within a Trusted Computing Platform. The TPM is a complete solution implementing the Trusted Platform Module Library Specification, Family "2.0", Level 00, Revision 01.16, October 2014 (ISO/IEC 11889:2015, Parts 1-4). See http://www.trustedcomputinggroup.org/ for further information on TCG and TPM.
Key facts
- Scheme
- FIPS 140
- Certificate
- 3203
- Standard
- FIPS 140-2
- Security level
- Level 2
- Status
- historical
- Vendor
- Infineon Technologies AG
- Module type
- Hardware
- Embodiment
- Single Chip
- Lab
- UL Verification Services, Inc.
- First validated
- June 20, 2018
- Versions
- SLB 9670 (Package PG-UQFN-32-1 or PG-VQFN-32-13); 7.83
- Caveat
- When operated in FIPS mode as specified in Security Policy Sections 1.1 and 8.1
Algorithms
- AES
- CVL
- DRBG
- ECDSA
- HMAC
- KAS
- KBKDF
- RSA
- SHS
Algorithm families of the CAVP certificates listed for this module, plus post-quantum algorithms named in its documents.
CVEs that may affect this product
sec-certs has not matched any CVE to this certificate. That is not proof the product is unaffected.
Related CVEs and certificate references are automated matches by sec-certs, not reviewed by humans: treat them as "may be affected" and verify before acting.
Documents and sources
Source: sec-certs.org (CRoCS, Masaryk University), from NIST CMVP and the Common Criteria Portal - dataset of September 21, 2026 - synced October 15, 2026
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