HiCOS Combi PKI Native Smart Card
Chunghwa Telecom Co., Ltd. - FIPS 140 #2338
The HiCOS Combi PKI native smart card module is a single chip implementation of a cryptographic module that supports ISO-7816 contact interface and ISO-14443 contactless interface. The HiCOS Combi PKI native smart card module is mounted in an ID-1 class smart card body that adheres to ISO/IEC specifications for Integrated Circuit Chip (ICC) based identification cards. The module consists of the chip (ICC), the contact faceplate, the contactless faceplate, and the electronic connectors between the chip and contact pad/antenna, all contained within an epoxy substrate.
Key facts
- Scheme
- FIPS 140
- Certificate
- 2338
- Standard
- FIPS 140-2
- Security level
- Level 2
- Status
- historical
- Vendor
- Chunghwa Telecom Co., Ltd.
- Module type
- Hardware
- Embodiment
- Single Chip
- Lab
- CGI Information Systems & Management Consultants Inc
- First validated
- March 16, 2015
- Versions
- RS46X and RS47X; HardMask: 2.3 and SoftMask: 3.5
- Caveat
- When operated in FIPS mode
Algorithms
- DRBG
- RSA
- SHS
- Triple-DES
Algorithm families of the CAVP certificates listed for this module, plus post-quantum algorithms named in its documents.
CVEs that may affect this product
sec-certs has not matched any CVE to this certificate. That is not proof the product is unaffected.
Related CVEs and certificate references are automated matches by sec-certs, not reviewed by humans: treat them as "may be affected" and verify before acting.
Documents and sources
Source: sec-certs.org (CRoCS, Masaryk University), from NIST CMVP and the Common Criteria Portal - dataset of September 21, 2026 - synced October 15, 2026
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